N-(β-aminoethyl)-γ-aminopropytrimethoxysilane 1760-24-3 A-1120 CAS NO.1760-24-3

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Application

1.Silane GX-792 may be used as an additive, eliminating the need for special primers in numerous bonding applications.  Specific systems that demonstrate improved adhesion when silane GX-792 is used are:

2. RTV Silicones and Hybrid Silane-Crosslinked Sealants

Silane GX-792 addition to one- and two-part silicone-crosslinked sealants improves adhesion to a variety of substrates, including glass, steel, aluminum and concrete.  This silane can dramatically enhance adhesion to a wide array of plastics when used in combination with SPUR^SM Technology for silylating urethane polymers.  (For formulation and silylated prepolymer preparation information, please refer to Literature bulletin #112-026-30, “Silquest Organofunctional Silanes – Crosslinkers and Adhesion promoters for Urethane Adhesives and Sealants.”  

3.Polysufide Sealants

When added to one- and two-part polysulfide sealants,  Silane GX-792 provides better adhesion to a variety of substrates, including glass, aluminum and steel. Silane GX-792 is typically used at a loading of 0.5 to 1.0 percent by weight to the sealant.  It disperses well and produces cohesive failure in the sealant rather than adhesive failure of the bond between the sealant and the substrate.

Furthermore, the use of silane GX-792 can eliminate the need for primers normally required to achieve adhesion to surfaces.

4.Plastisol Sealants

Adding Silane GX-792(0.5 to 1.5 weight percent) as a replacement for polyaminoamide adhesion promoters in plastisol sealants improves bonding to metal substrates.

In addition to increased strength, the silane-modified plastisol sealant has better overall appearance than a system that uses polyaminoamide adhesion promoters. Silane GX-792-modified plastisol systems have a very light color, and the cured compound is bubble-free.

5.Additive in Phenolic and Epoxy Molding Compounds

Silane GX-792, as an additive in phenolic and epoxy molding compounds, reduces the water absorption of molded composites.  This, in turn, leads to improved wet electrical properties, particularly at low frequencies.  High-temperature strength properties are also improved.